New Publication in industry magazine „microProduction“
Eitzenberger’s Dynamic Waferstage with dual impulse decoupling is featured in the latest issue of the industry magazine microProduction. This innovative development significantly enhances both dynamics and precision in laser micromachining.
With a fully impulse-decoupled, air-bearing positioning system, the Dynamic Waferstage minimizes unwanted vibrations while boosting travel speed and process stability — setting new standards in high-performance motion systems.
The result:
- Improved beam positioning on the wafer plane
- Higher process reliability in complex laser trimming applications
- Optimized machining quality at maximum dynamics
The article also explores how this technology is being applied in high-precision manufacturing — for example, in 3D-Micromac AG’s microVEGA FC systems for link trimming.
