The EZ-GS0760 wafer stage has been developed for high-dynamic processes, such as laser fuse cutting. It offers excellent repeatability, optimal accuracy, and exceptional dynamic performance.

Built-in features:

• Mechanical impulse decoupling in both the X- and Y-axes for enhanced dynamic and positional stability.
• The unique design with a common reaction mass for both axes keeps reaction forces independent of the measuring frame and minimizes mass.
• A high-resolution SIOS differential laser interferometer ensures virtually Abbe-error-free performance, minimizing measurement errors at the point of interest, even at maximum dynamics.
• Outstanding Y-axis acceleration up to 8 g; water cooling allows travel profiles with up to 2 g continuous acceleration.
• The Y-axis natural frequency, including wafer chuck, exceeds 500 Hz.
• The compact height of just 87 mm provides a low center of gravity and enables high dynamics.
• Large top plate (granite) to accommodate customer applications.